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| Description |
English: Chevron test setup for determine the wafer bond strength of different bonding techniques. |
| Source | Ö. Vallin and K. Jonsson and U. Lindberg, Adhesion quantification methods for wafer bonding (2005) |
| Author | Fraunhofer ENAS, D. Neumann |
| Permission (Reusing this file) |
   This file is licensed under the Creative Commons Attribution-Share Alike 3.0 Germany license. Attribution: Fraunhofer ENAS
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| Date/Time | Thumbnail | Dimensions | User | Comment | |
|---|---|---|---|---|---|
| current | 12:02, 10 April 2011 | | 531 × 401 (9 KB) | Enaswiki | {{Information |Description ={{en|1=Chevron test setup for determine the wafer bond strength of different bonding techniques}} |Source ={{own}} |Author =Enaswiki |Date = |Permission ={{cc-by-sa-3.0-de|Frau |
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