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| Description | Schematic process flow of dry etch and photosensitive BCB wafer bonding technique. |
| Date | (UTC) |
| Source | J. Oberhammer and F. Niklaus and G. Stemme, Selective wafer-level adhesive bonding with benzocyclobutene for fabrication of cavities (2003) |
| Author | Fraunhofer ENAS, D. Neumann |
| Permission (Reusing this file) |
   This file is licensed under the Creative Commons Attribution-Share Alike 3.0 Germany license. Attribution: Fraunhofer ENAS
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| Date/Time | Thumbnail | Dimensions | User | Comment | |
|---|---|---|---|---|---|
| current | 10:56, 30 March 2011 | | 679 × 847 (20 KB) | Enaswiki | |
| 10:52, 30 March 2011 |  | 679 × 847 (19 KB) | Enaswiki | Category:Wafer bonding Category:Adhesive bonding | |
| 18:10, 28 March 2011 |  | 667 × 862 (14 KB) | Enaswiki | {{Information |Description ={{en|1=Schematic process flow of dry-etch and photosenstivie BCB wafer bonding technique.}} |Source =Selective wafer-level adhesive bonding with benzocyclobutene for fabrication of cavities |Author =Oberhamme |
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