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Description
English: Schematic SU-8 wafer bond process.
Source M. Wiemer and C. Jia and M. Töpper and K. Hauck, Wafer Bonding with BCB and SU-8 for MEMS Packaging (2006)
Author Fraunhofer ENAS, D. Neumann
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current11:01, 30 March 2011Thumbnail for version as of 11:01, 30 March 2011476 × 616 (9 KB)Enaswiki{{Information |Description ={{en|1=Schematic SU-8 wafer bond process.}} |Source =M. Wiemer and C. Jia and M. Töpper and K. Hauck, Wafer Bonding with BCB and SU-8 for MEMS Packaging (2006) |Author =Fraunhofer ENAS, [[U

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