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Summary
| Description |
English: Microscopic cross sectional SEM images of glass frit bonded silicon wafers from Bosch. |
| Date | |
| Source |
M. Petzold and C. Dresbach and M. Ebert and J. Bagdahn and M. Wiemer and K. Glien and J. Graf and R. Müller-Fiedler and H. Höfer, Fracture mechanical life-time investigation of glass frit-bonded sensors (2006)
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| Author | Uploaded by Enaswiki at en.wikipedia |
Licensing
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Attribution: Fraunhofer ENAS
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Original upload log
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Upload date | User | Bytes | Dimensions | Comment
- 2011-03-30 11:33 (UTC) | Enaswiki | 268400 (bytes) | 1511×1182 | {{Information |Description = Microscopic cross sectional SEM images of glass frit bonded silicon wafers from Bosch. |Source = M. Petzold and C. Dresbach and M. Ebert and J. Bagdahn and M. Wiemer and K. Glien and J. Graf and R. Müller-Fiedler
File history
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| Date/Time | Thumbnail | Dimensions | User | Comment | |
|---|---|---|---|---|---|
| current | 12:28, 27 December 2011 | | 1,511 × 1,182 (262 KB) | SreeBot | (Original text) : {{Information |Description = Microscopic cross sectional SEM images of glass frit bonded silicon wafers from Bosch. |Source = M. Petzold and C. Dresbach and M. Ebert and J. Bagdahn and M. Wiemer and K. Glien and J. Graf and |
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