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Summary
| Description |
English: Ti-Si bonding interface of a thermo compression wafer bond. |
| Date | |
| Source |
M. Wiemer and J. Frömel and J. Chenping, J. and M. Haubold and T. Gessner, Waferbond technologies and quality assessment (2008)
|
| Author | Uploaded by Enaswiki at en.wikipedia |
Licensing
This file is licensed under the Creative Commons Attribution-Share Alike 3.0 Germany license.
Attribution: Fraunhofer ENAS
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Original upload log
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Upload date | User | Bytes | Dimensions | Comment
- 2011-03-30 11:36 (UTC) | Enaswiki | 256081 (bytes) | 1781×1388 | {{Information |Description = Ti-Si bonding interface of a thermo compression wafer bond. |Source = M. Wiemer and J. Frömel and J. Chenping, J. and M. Haubold and T. Gessner, Waferbond technologies and quality assessment (2008) |Date
File history
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| Date/Time | Thumbnail | Dimensions | User | Comment | |
|---|---|---|---|---|---|
| current | 12:28, 27 December 2011 | | 1,781 × 1,388 (250 KB) | SreeBot | (Original text) : {{Information |Description = Ti-Si bonding interface of a thermo compression wafer bond. |Source = M. Wiemer and J. Frömel and J. Chenping, J. and M. Haubold and T. Gessner, Waferbond technologies and quality assessment (20 |
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