_process.svg){kind=link}
_process.svg&action=edit&redlink=1){kind=link}
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_process.svg){kind=link}
Summary
| Description |
English: The image illustrates the Lift-off process used in microfabrication mostly to create metallic interconnects.
I. Preparation of the substrate II. Deposition of the sacrificial stencil layer III. Patterning the sacrificial layer (ex. etching), creating an inverse pattern IV. Depostion of the target material V. Washing out the sacrificial layer together with the target material on its surface VI. Final pattern 1) Substrate 2) Sacrificial layer 3) Target material |
| Date | 07.04.2008 |
| Source | Own work |
| Author | Twisp |
Licensing
|
I, the copyright holder of this work, release this work into the public domain. This applies worldwide. In some countries this may not be legally possible; if so: I grant anyone the right to use this work for any purpose, without any conditions, unless such conditions are required by law. |
File history
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| Date/Time | Thumbnail | Dimensions | User | Comment | |
|---|---|---|---|---|---|
| current | 19:10, 14 December 2009 | | 512 × 664 (31 KB) | Cepheiden | optimized |
| 02:08, 7 April 2008 |  | 625 × 837 (61 KB) | Twisp | {{Information |Description= {{en|The image illustrates the Lift-off process used in microfabrication mostly to create metallic interconnects. I. Preparation of the substrate II. Deposition of the sacrificial stencil layer III. Patterning the sacrificial |
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_process.svg){kind=link}