Talk:Polyimide
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Wikify tag
editHTML table needs to be converted to wiki markup. I'm no good at tables --Closedmouth 09:05, 19 June 2007 (UTC)
New application for PolyImide
editThought it would be useful to cite another application of polyimide resin.
An additional use of polyimide resin is an an insulating layer in the Cite error: There are <ref> tags on this page without content in them (see the help page).manufacture of digital isolator semiconductor chips. The polyimide layers have good mechanical elongation and tensile strength, which also helps the adhesion between the polyimide layers or between polyimide layer and deposited metal layer, (see figure). The minimum interaction between the gold film and the polyimide film, coupled with high temperature stability of the polyimide film, results in a system that provides reliable insulation when subjected to various types of environmental stresses.
polyimide resin as an insulating layer - new semiconductor application
editThought it would be useful to cite another application of polyimide resin.
An additional use of polyimide resin is an an insulating layer in the manufacture of digital isolator semiconductor chips. The polyimide layers have good mechanical elongation and tensile strength, which also helps the adhesion between the polyimide layers or between polyimide layer and deposited metal layer, (see figure). The minimum interaction between the gold film and the polyimide film, coupled with high temperature stability of the polyimide film, results in a system that provides reliable insulation when subjected to various types of environmental stresses.YoungGalahad (talk) 20:39, 17 November 2009 (UTC) [2]
Extra properties
edit| Properties | |
|---|---|
| Young's modulus | 3.2 GPa |
| Tensile strength | 75–90 MPa |
| Elongation @ break | 4–8% |
| Notch test | 4–8 kJ/m |
| Glass temperature | >400 °C |
| Vicat softening point | 220(?) °C[3] |
| Thermal conductivity | 0.52 W/(m·K) |
| Coefficient of thermal expansion | 5.5×10−5 /K |
| Specific heat capacity | 1.15 kJ/(kg·K) |
| Water absorption (ASTM) | 0.32 |
| Dielectric constant at 1 MHz | 3.5 |
Moved this here from the page, as Chembox has no current way to code for these properties.--Auric talk 13:13, 5 April 2014 (UTC)
References
- ^ http://www.analog.com/static/imported-files/overviews/icoupler_baoxing.pdf
- ^ http://www.analog.com/static/imported-files/overviews/isoPower.pdf
- ^ Deformation temperature at 10 kN needle load, source: A.K. vam der Vegt & L.E. Govaert, Polymeren,van keten tot kunststof, ISBN 90-407-2388-5
- This will be data for just one particular polyimide (which one?) and isn't appropriate content anyway for an article about a class of polymers. -- Ed (Edgar181) 17:09, 7 April 2014 (UTC)
intro paragraph missing image
editthe intro paragraph says "The structure of imide is as shown" but the page has no images at all. — Preceding unsigned comment added by Nmz787 (talk • contribs) 20:30, 18 July 2014 (UTC)
- I added an image to the article. -- Ed (Edgar181) 21:30, 18 July 2014 (UTC)
Illustration of polymer structure
editRepeating unit structure is incorrect on several points.For example: Two C=O groups should be coming out of “R1” and connecting to the N (nitrogen atom), which should connect via a single bond to “R2”, which should connect outside the bracket to dotted lines implying connection to “R1”,to continue this polymer. That would correspond to the structure of polymeric 4-aminophthalic anhydride, the first example mentioned. As drawn, the “R2” group looks like a side-chain when in fact it is in the polymer backbone. Please fix. 2600:4809:2252:A200:4D7B:443F:57D5:A74E (talk) 21:24, 1 December 2024 (UTC)