A Fuzz Button is a high performance electrical connection material used to connect two parts of an electrical circuit together, for example an IC to a PCB or two PCBs to each other. Fuzz Buttons consist of a single strand of gold-plated beryllium copper wire compressed into a dense, sponge-like cylindrical shape. Their diameter can range from a few tenths of a millimetre to a millimetre.[1][2]
The term "Fuzz Button" was originally conceived and trademarked by Tecknit, but is now owned by a Denver-based company called Custom Interconnects.
Practical uses
editThis kind of connection is used in cases where permanent connection techniques like soldering or non-permanent ones like pogo pins or elastomeric "Zebra" connectors are not suitable, for example due to extreme vibrations or temperatures. They can also be used where low-distortion signal transmission is needed, like on PCB (board-to-board) interconnects, or in IC testing sockets where additionally many mating cycles are required. They can be used discretely as a signal/ground contact or for Electromagnetic interference (EMI) protection. When a mating array for multiple contacts is needed, like for BGA or LGA IC packages, Fuzz Buttons can be placed in thru-holes in an insulated piece of material, such as dielectric plastic.
Fuzz Buttons are commonly utilized in satellite and space applications, but are also broadly used in military and commercial applications.
See also
editReferences
edit- ^ Doane, Daryl Ann; Paul D. Franzon (1993). Multichip module technologies and alternatives: the basics. Springer. p. 506. ISBN 978-0-442-01236-6.
- ^ Ekin, J. W. (2006). Experimental techniques for low-temperature measurements: cryostat design, material properties, and superconductor critical-current testing. Oxford University Press. pp. 307–308. ISBN 978-0-19-857054-7.
Further reading
edit- Harris, D.B.; Pecht, M.G. (1995). "A Reliability Study of Fuzz Button Interconnects". Circuit World. 21 (2): 12. doi:10.1108/eb046298.
- Carter, D. (2000). "'Fuzz Button' interconnects at microwave and mm-wave frequencies". IEE Seminar on Packaging and Interconnects at Microwave and MM-Wave Frequencies. Vol. 2000. p. 3. doi:10.1049/ic:20000419.
- Pan, G.; Zhu, X.; Gilbert, B. (1993). "A quasi-static analysis of fuzz button interconnects". Proceedings 1993 IEEE Multi-Chip Module Conference MCMC-93. p. 85. doi:10.1109/MCMC.1993.302146. ISBN 0-8186-3540-1. S2CID 122086618.