List of AMD Ryzen processors

The Ryzen family is an x86-64 microprocessor family from AMD, based on the Zen microarchitecture. The Ryzen lineup includes Ryzen 3, Ryzen 5, Ryzen 7, Ryzen 9, and Ryzen Threadripper with up to 96 cores. All consumer desktop Ryzens (except PRO models) and all mobile processors with the HX suffix have an unlocked multiplier. In addition, all support Simultaneous Multithreading (SMT) except earlier Zen/Zen+ based desktop and mobile Ryzen 3, and some models of Zen 2 based mobile Ryzen.

Desktop processors

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Ryzen 1000 series

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Summit Ridge (1000 series, Zen based)

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Common features of Ryzen 1000 desktop CPUs:

  • Socket: AM4.
  • All the CPUs support DDR4-2666 in dual-channel mode.
  • All the CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
  • No integrated graphics.
  • L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • Node/fabrication process: GlobalFoundries 14 LP.
Branding and Model Cores
(threads)
Clock rate (GHz) L3 cache
(total)
TDP Core
config[i]
Release
date
Launch
price[a]
Base PBO
1–2
(≥3)
XFR[1]
1–2
Ryzen 7 1800X[2] 8 (16) 3.6 4.0
(3.7)
4.1 16 MB 95 W 2 × 4 March 2, 2017 US $499
PRO 1700X 3.4 3.8
(3.5)
3.9 June 29, 2017 OEM
1700X[2] March 2, 2017 US $399
PRO 1700 3.0 3.7
(3.2)
3.75 65 W June 29, 2017 OEM
1700[2] March 2, 2017 US $329
Ryzen 5 1600X[3] 6 (12) 3.6 4.0
(3.7)
4.1 95 W 2 × 3 April 11, 2017 US $249
PRO 1600 3.2 3.6
(3.4)
3.7 65 W June 29, 2017 OEM
1600[3] April 11, 2017 US $219
1500X[3] 4 (8) 3.5 3.7
(3.6)
3.9 2 × 2 US $189
PRO 1500 June 29, 2017 OEM
1400[3] 3.2 3.4
(3.4)
3.45 8 MB April 11, 2017 US $169
Ryzen 3 1300X[4] 4 (4) 3.5 3.7
(3.5)
3.9 July 27, 2017 US $129
PRO 1300 June 29, 2017 OEM
PRO 1200 3.1 3.4
(3.1)
3.45
1200[4] July 27, 2017 US $109
  1. ^ Core Complexes (CCX) × cores per CCX


Whitehaven (Threadripper 1000 series, Zen based)

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Common features of Ryzen 1000 HEDT CPUs:

  • Socket: TR4.
  • All the CPUs support DDR4-2666 in quad-channel mode.
  • All the CPUs support 64 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
  • No integrated graphics.
  • L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • Node/fabrication process: GlobalFoundries 14LP.
Branding and Model Cores
(threads)
Clock rate (GHz) L3 cache
(total)
TDP Chiplets Core
config[i]
Release
date
Launch
price[a]
Base PBO
1–4
(≥5)
XFR[1]
1–2
Ryzen
Threadripper
1950X[5] 16 (32) 3.4 4.0
(3.7)
4.2 32 MB 180 W 2 × CCD[ii] 4 × 4 August 10, 2017 US $999
1920X[5] 12 (24) 3.5 4 × 3 US $799
1900X[5] 8 (16) 3.8 4.0
(3.9)
16 MB 2 × 4 August 31, 2017 US $549
  1. ^ Core Complexes (CCX) × cores per CCX
  2. ^ Processor package actually contains two additional inactive dies to provide structural support to the integrated heat spreader.


Ryzen 2000 series

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Raven Ridge (2000 series with Radeon Graphics, Zen/GCN5 based)

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Common features of Ryzen 2000 desktop APUs:

Branding and Model CPU GPU TDP Release
date
Launch
price[a]
Cores
(threads)
Clock rate (GHz) L3 cache
(total)
Model Clock
(GHz)
Config[i] Processing
power
(GFLOPS)[ii]
Base Boost
Ryzen 5 2400G[6][b] 4 (8) 3.6 3.9 4 MB RX Vega 11 1.25 704:44:16
11 CU
1760 46–65 W February 12, 2018 US $169
2400GE[b] 3.2 3.8 35 W April 19, 2018 OEM
Ryzen 3 2200G[6][b] 4 (4) 3.5 3.7 Vega 8 1.1 512:32:16
8 CU
1126 46–65 W February 12, 2018 US $99
2200GE[b] 3.2 3.6 35 W April 19, 2018 OEM
PRO 2100GE[7] 2 (4) Vega 3 1.0 192:12:4
3 CU[8]
384 2019
  1. ^ Unified Shaders : Texture Mapping Units : Render Output Units and Compute Units (CU)
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. ^ Manufacturer suggested retail price at launch
  2. ^ a b c d Model also available as PRO version; 2200GE, 2200G, 2400GE, 2400G, released on May 14, 2018 for OEM only.[9]

Pinnacle Ridge (2000 series, Zen+ based)

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Common features of Ryzen 2000 desktop CPUs:

  • Socket: AM4.
  • All the CPUs support DDR4-2933 in dual-channel mode, except for R7 2700E, R5 2600E, R5 1600AF and R3 1200AF which support it at DDR4-2666 speeds.
  • All the CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
  • No integrated graphics.
  • L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • Fabrication process: GlobalFoundries 12LP (14LP+).
Branding and Model Cores
(threads)
Clock rate (GHz) L3 cache
(total)
TDP Core
config[i]
Release
date
Launch
price[a]
Base PB2
Ryzen 7 2700X[10][b] 8 (16) 3.7 4.3 16 MB 105 W 2 × 4 April 19, 2018 US $329
2700[10][b] 3.2 4.1 65 W US $299
2700E 2.8 4.0 45 W September 19, 2018 OEM
Ryzen 5 2600X[10] 6 (12) 3.6 4.2 95 W 2 × 3 April 19, 2018 US $229
2600[10][b] 3.4 3.9 65 W US $199
2600E 3.1 4.0 45 W September 19, 2018 OEM
1600 (AF)[14][c] 3.2 3.6 65 W October 11, 2019[15] US $85
2500X 4 (8) 3.6 4.0 8 MB 1 × 4 September 10, 2018 OEM
Ryzen 3 2300X 4 (4) 3.5
1200 (AF)[16][c] 3.1 3.4 April 21, 2020 US $60
  1. ^ Core Complexes (CCX) × cores per CCX
  1. ^ Manufacturer suggested retail price at launch
  2. ^ a b c Model also available as PRO version as 2600[11], 2700[12], 2700X[13], released on September 19, 2018.
  3. ^ a b AF models are 12 nm Zen+ refresh of 14 nm Zen models (1200[17] and 1600[18] with "AF" instead of "AE" in the part numbers).

Colfax (Threadripper 2000 series, Zen+ based)

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Common features of Ryzen 2000 HEDT CPUs:

  • Socket: TR4.
  • All the CPUs support DDR4-2933 in quad-channel mode.
  • All the CPUs support 64 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
  • No integrated graphics.
  • L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • Fabrication process: GlobalFoundries 12LP (14LP+).
Branding and Model Cores
(threads)
Clock rate (GHz) L3 cache
(total)
TDP Chiplets Core
config[i]
Release
date
Launch
price[a]
Base PB2
Ryzen
Threadripper
2990WX[19][20] 32 (64) 3.0 4.2 64 MB 250 W 4 × CCD 8 × 4 Aug 13, 2018 US $1799
2970WX[21][20] 24 (48) 8 × 3 Oct 2018 US $1299
2950X[22][20] 16 (32) 3.5 4.4 32 MB 180 W 2 × CCD 4 × 4 Aug 31, 2018 US $899
2920X[23][20] 12 (24) 4.3 4 × 3 Oct 2018 US $649
  1. ^ Core Complexes (CCX) × cores per CCX

Ryzen 3000 series

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Picasso (3000 series with Radeon Graphics, Zen+/GCN5 based)

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Common features of Ryzen 3000 desktop APUs:

Branding and Model CPU GPU TDP Release
date
MSRP
Cores
(threads)
Clock rate (GHz) L3 cache
(total)
Model Clock
(GHz)
Config[i] Processing
power
(GFLOPS)[ii]
Base Boost
Ryzen 5 PRO 3400G 4 (8) 3.7 4.2 4 MB Radeon
RX Vega 11
1.4 704:44:8
11 CU
1971.2 65 W Sep 30, 2019 OEM
3400G[24] Jul 7, 2019 US $149
PRO 3400GE 3.3 4.0 1.3 1830.4 35 W Sep 30, 2019 OEM
PRO 3350G 3.6 Radeon
Vega 10
640:40:8
10 CU
1664 65 W Jul 21, 2020
PRO 3350GE 4 (4) 3.3 3.9 1.2 1536 35 W
Ryzen 3 PRO 3200G 3.6 4.0 Radeon
Vega 8
1.25 512:32:8
8 CU
1280 65 W Sep 30, 2019
3200G[24] Jul 7, 2019 US $99
3200GE 3.3 3.8 1.2 1228.8 35 W Jul 7, 2019 OEM
PRO 3200GE Sep 30, 2019
  1. ^ Unified shaders : Texture mapping units : Render output units and Compute units (CU)
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.


Matisse (3000 series, Zen 2 based)

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Common features of Ryzen 3000 desktop CPUs:

  • Socket: AM4.
  • All the CPUs support DDR4-3200 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • All the CPUs support 24 PCIe 4.0 lanes. 4 of the lanes are reserved as link to the chipset.
  • No integrated graphics.
  • Fabrication process: TSMC 7FF.
Branding and Model Cores
(threads)
Thermal Solution Clock rate (GHz) L3 cache
(total)
TDP Chiplets[i] Core
config[ii]
Release
date
MSRP
Base Boost
Ryzen 9 3950X 16 (32) N/A 3.5 4.7 64 MB 105 W[iii] 2 × CCD
1 × I/OD
4 × 4 Nov 25, 2019 US $749
3900XT 12 (24) 3.8 4 × 3 Jul 7, 2020 US $499
3900X Wraith Prism 4.6 Jul 7, 2019
3900[a] OEM 3.1 4.3 65 W Oct 8, 2019 OEM
Ryzen 7 3800XT 8 (16) N/A 3.9 4.7 32 MB 105 W 1 × CCD
1 × I/OD
2 × 4 Jul 7, 2020 US $399
3800X Wraith Prism 4.5 Jul 7, 2019
3700X[a] 3.6 4.4 065 W[iv] US $329
Ryzen 5 3600XT 6 (12) N/A 3.8 4.5 95 W 2 × 3 Jul 7, 2020 US $249
3600X Wraith Spire (non-LED) 4.4 Jul 7, 2019
3600[a] Wraith Stealth 3.6 4.2 65 W US $199
3500X[27] 6 (6) 4.1 Oct 8, 2019 China
¥1099
3500 OEM 16 MB Nov 15, 2019 OEM (West)
Japan
¥16000[28]
Ryzen 3 3300X 4 (8) Wraith Stealth 3.8 4.3 1 × 4 Apr 21, 2020 US $119
3100 3.6 3.9 2 × 2 US $99
  1. ^ A Core Complex Die contain 1-2 Core Complexes (CCXs).
  2. ^ Core Complexes (CCXs) × cores per CCX
  3. ^ Ryzen 9 3900X and Ryzen 9 3950X may consume over 145 W under load.[25]
  4. ^ Ryzen 7 3700X may consume 90 W under load.[26]
  1. ^ a b c Model also available as PRO 3600, PRO 3700, PRO 3900, released on September 30, 2019 for OEMs.

Castle Peak (Threadripper 3000 series, Zen 2 based)

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Common features of Ryzen 3000 HEDT/workstation CPUs:

  • Socket: sTRX4 (Threadripper), sWRX8 (Threadripper PRO).
  • Threadripper CPUs support DDR4-3200 in quad-channel mode while Threadripper PRO CPUs support DDR4-3200 in octa-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • Threadripper CPUs support 64 PCIe 4.0 lanes while Threadripper PRO CPUs support 128 PCIe 4.0 lanes. 8 of the lanes are reserved as link to the chipset.
  • No integrated graphics.
  • Fabrication process: TSMC 7FF.
Branding and Model Cores
(threads)
Clock rate (GHz) L3 cache
(total)
TDP Chiplets Core
config[i]
Release
date
MSRP
Base Boost
Ryzen
Threadripper
PRO
3995WX 64 (128) 2.7 4.2 256 MB 280 W
[ii]
8 × CCD
1 × I/OD
16 × 4 Jul 14, 2020
3975WX 32 (64) 3.5 128 MB 4 × CCD
1 × I/OD
8 × 4
3955WX 16 (32) 3.9 4.3 64 MB 2 × CCD
1 × I/OD
4 × 4
3945WX 12 (24) 4.0 4 × 3
Ryzen
Threadripper
3990X 64 (128) 2.9 256 MB 8 × CCD
1 × I/OD
16 × 4 Feb 7, 2020 US $3990
3970X 32 (64) 3.7 4.5 128 MB 4 × CCD
1 × I/OD
8 × 4 Nov 25, 2019 US $1999
3960X 24 (48) 3.8 8 × 3 US $1399
  1. ^ Core Complexes (CCXs) × cores per CCX
  2. ^ Ryzen Threadripper 3990X may consume over 490 W under load.[29]

Ryzen 4000 series

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Renoir (4000 series, Zen 2 based)

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Based on the Ryzen 4000G series APUs with the integrated GPU disabled. Common features of Ryzen 4000 desktop CPUs:

  • Socket: AM4.
  • All the CPUs support DDR4-3200 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • All the CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
  • No integrated graphics.
  • Fabrication process: TSMC 7FF.
  • Bundled with AMD Wraith Stealth

The AMD 4700S and 4800S desktop processors are part of a "desktop kit" that comes bundled with a motherboard and GDDR6 RAM. The CPU is soldered, and provides 4 PCIe 2.0 lanes. These are reportedly cut-down variants of the APUs found on the PlayStation 5 and Xbox Series X and S repurposed from defective chip stock.[30][31][32]

Branding and model Cores
(threads)
Clock rate (GHz) L3 cache
(total)
TDP Core
config[i]
Release
date
MSRP
Base Boost
AMD 4800S[30][31] 8 (16) 4.0 8 MB 2 × 4 2022 bundled with desktop kit
4700S[32] 3.6 75 W 2021
Ryzen 5 4500 6 (12) 4.1 65 W 2 × 3 Apr 4, 2022 US $129
Ryzen 3 4100 4 (8) 3.8 4.0 4 MB 1 × 4 US $99
  1. ^ Core Complexes (CCX) × cores per CCX

Renoir (4000 series with Radeon Graphics, Zen 2/GCN5 based)

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Common features of Ryzen 4000 desktop APUs:

  • Socket: AM4.
  • All the CPUs support DDR4-3200 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • All the CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
  • Includes integrated GCN 5th generation GPU.
  • Fabrication process: TSMC 7FF.
Branding and model CPU GPU TDP Release
date
Release
price
Cores
(threads)
Clock rate (GHz) L3 cache
(total)
Core
Config[i]
Model Clock
(GHz)
Config[ii] Processing
power[iii]
(GFLOPS)
Base Boost
Ryzen 7 4700G[a] 8 (16) 3.6 4.4 8 MB 2 × 4 Radeon
Graphics[b]
2.1 512:32:16
8 CU
2150.4 65 W Jul 21, 2020 OEM
4700GE[a] 3.1 4.3 2.0 2048 35 W
Ryzen 5 4600G[a][33] 6 (12) 3.7 4.2 2 × 3 1.9 448:28:14
7 CU
1702.4 65 W Jul 21, 2020
(OEM) /
Apr 4, 2022
(retail)
OEM /
US $154
4600GE[a] 3.3 35 W Jul 21, 2020 OEM
Ryzen 3 4300G[a] 4 (8) 3.8 4.0 4 MB 1 × 4 1.7 384:24:12
6 CU
1305.6 65 W
4300GE[a] 3.5 35 W
  1. ^ Core complexes (CCXs) × cores per CCX
  2. ^ Unified shaders : Texture mapping units : Render output units and Compute units (CU)
  3. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. ^ a b c d e f Model also available as PRO version as 4350GE,[34] 4350G,[35] 4650GE,[36] 4650G,[37] 4750GE,[38] 4750G,[39] released on July 21, 2020 for OEM only.[40]
  2. ^ All of the iGPUs are branded as AMD Radeon Graphics.

Ryzen 5000 series

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Vermeer (5000 series, Zen 3 based)

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Common features of Ryzen 5000 desktop CPUs:

  • Socket: AM4.
  • All the CPUs support DDR4-3200 in dual-channel mode.
  • All the CPUs support 24 PCIe 4.0 lanes. 4 of the lanes are reserved as link to the chipset.
  • No integrated graphics.
  • L1 cache: 64 KB per core (32 KB data + 32 KB instruction).
  • L2 cache: 512 KB per core.
  • Fabrication process: TSMC 7FF.
Branding and model Cores
(threads)
Thermal
solution
Clock rate (GHz) L3 cache
(total)
TDP Chiplets Core
config[i]
Release
date
MSRP
Base Boost
Ryzen 9 5950X 16 (32) 3.4 4.9 64 MB 105 W 2 × CCD
1 × I/OD
2 × 8 Nov 5, 2020 US $799
5900XT 3.3 4.8 Jul 31, 2024 US $349
5900X 12 (24) 3.7 2 × 6 Nov 5, 2020 US $549
5900 3.0 4.7 65 W Jan 12, 2021 OEM
PRO 5945 Sep 2022[41]
Ryzen 7 5800X3D 8 (16) 3.4 4.5 96 MB 105 W 1 × CCD
1 × I/OD
1 × 8 Apr 20, 2022 US $449
5800XT Wraith Prism 3.8 4.8 32 MB Jul 31, 2024 US $249
5800X 4.7 Nov 5, 2020 US $449
5800 3.4 4.6 65 W Jan 12, 2021 OEM
5700X3D 3.0 4.1 96 MB 105 W Jan 31, 2024[42] US $249
5700X 3.4 4.6 32 MB 65 W Apr 4, 2022 US $299
PRO 5845 Sep 2022 OEM
Ryzen 5 5600X3D 6 (12) 3.3 4.4 96 MB 105 W 1 × 6 Jul 7, 2023
US Only[43]
US $229[44]
5600XT Wraith Stealth 3.7 4.7 32 MB 65 W Oct 31, 2024 US $194[45]
5600X 3.7 4.6 Nov 5, 2020 US $299
5600T 3.5 4.5 Oct 31, 2024 US $186[45]
5600 3.5 4.4 Apr 4, 2022 US $199
PRO 5645 3.7 4.6 Sep 2022 OEM
  1. ^ Core Complexes (CCX) × cores per CCX

Cezanne (5000 series, Zen 3 based)

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Cezanne based CPUs that have the integrated GPU disabled. Common features of Ryzen 5000 (Cezanne) desktop CPUs:

  • Socket: AM4.
  • CPUs support DDR4-3200 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
  • No integrated graphics.
  • Fabrication process: TSMC 7FF.
Branding and model Cores
(threads)
Thermal
solution
Clock rate (GHz) L3 cache
(total)
TDP Core
config[i]
Release
date
MSRP
(USD)
Base Boost
Ryzen 7 5700[46] 8 (16) Wraith Stealth 3.7 4.6 16 MB 65 W 1 × 8 Apr 4, 2022 (OEM),
Dec 21, 2023 (retail)
$179
Ryzen 5 5500 6 (12) 3.6 4.2 1 × 6 Apr 4, 2022 $159
Ryzen 3 5100[47][48][49] 4 (8) 3.8 8 MB 1 × 4 2023 OEM
  1. ^ Core Complexes (CCX) × cores per CCX

Cezanne (5000 series with Radeon Graphics, Zen 3/GCN5 based)

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Common features of Ryzen 5000 desktop APUs:

  • Socket: AM4.
  • All the CPUs support DDR4-3200 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • All the CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
  • Includes integrated GCN 5th generation GPU.
  • Fabrication process: TSMC 7FF.
Branding and model CPU GPU[a] Thermal
solution
TDP Release
date
MSRP
Cores
(threads)
Clock rate (GHz) L3 cache
(total)
Core
config[i]
Clock
(MHz)
Config[ii] Processing
power[iii]
(GFLOPS)
Base Boost
Ryzen 7 5700G[b] 8 (16) 3.8 4.6 16 MB 1 × 8 2000 512:32:8
8 CU
2048 Wraith Stealth 65 W Apr 13, 2021 (OEM),
Aug 5, 2021 (retail)
US $359
5700GE[b] 3.2 35 W Apr 13, 2021 OEM
Ryzen 5 5600GT 6 (12) 3.6 1 × 6 1900 448:28:8
7 CU
1702.4 65 W Jan 31, 2024[50] US $140
5600G[b] 3.9 4.4 Apr 13, 2021 (OEM),
Aug 5, 2021 (retail)
US $259
5600GE[b] 3.4 35 W Apr 13, 2021 OEM
5500GT 3.6 65 W Jan 31, 2024[50] US $125
Ryzen 3 5300G[b] 4 (8) 4.0 4.2 8 MB 1 × 4 1700 384:24:8
6 CU
1305.6 OEM Apr 13, 2021 OEM
5300GE[b] 3.6 35 W
  1. ^ Core Complexes (CCX) × cores per CCX
  2. ^ Unified shaders : texture mapping units : render output units and compute units (CU)
  3. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. ^ All of the iGPUs are branded as AMD Radeon Graphics.
  2. ^ a b c d e f Model also available as PRO version as 5350GE,[51] 5350G,[52] 5650GE,[53] 5650G,[54] 5750GE,[55] 5750G,[56] released June 1, 2021.[57]

Chagall (Threadripper 5000 series, Zen 3 based)

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Common features of Ryzen 5000 workstation CPUs:

  • Socket: sWRX8.
  • All the CPUs support DDR4-3200 in octa-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • All the CPUs support 128 PCIe 4.0 lanes. 8 of the lanes are reserved as link to the chipset.
  • No integrated graphics.
  • Fabrication process: TSMC 7FF.
Branding and Model Cores
(threads)
Clock rate (GHz) L3 cache
(total)
TDP Chiplets Core
config[i]
Release
date
MSRP
Base Boost
Ryzen
Threadripper
PRO
5995WX 64 (128) 2.7 4.5 256 MB 280 W 8 × CCD
1 × I/OD
8 × 8 Mar 8, 2022
(OEM) /
?
(retail)
OEM /
US $6500
5975WX 32 (64) 3.6 128 MB 4 × CCD
1 × I/OD
4 × 8 Mar 8, 2022
(OEM) /
?
(retail)
OEM /
US $3300
5965WX 24 (48) 3.8 4 × 6 Mar 8, 2022
(OEM) /
?
(retail)
OEM /
US $2400
5955WX 16 (32) 4.0 64 MB 2 × CCD
1 × I/OD
2 × 8 Mar 8, 2022 OEM
5945WX 12 (24) 4.1 2 × 6
  1. ^ Core Complexes (CCX) × cores per CCX

Ryzen 7000 series

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Raphael (7000 series, Zen 4/RDNA2 based)

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Common features of Ryzen 7000 desktop CPUs:

  • Socket: AM5.
  • All the CPUs support DDR5-5200 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 1 MB per core.
  • All the CPUs support 28 PCIe 5.0 lanes. 4 of the lanes are reserved as link to the chipset.
  • Includes integrated RDNA 2 GPU on the I/O die with 2 CUs and clock speeds of 400 MHz (base), 2.2 GHz (boost).[i] Models with "F" suffixes are without iGPUs.
  • Fabrication process: TSMC N5 FinFET (N6 FinFET for the I/O die).
Branding and model Cores
(threads)
Clock rate (GHz) L3 cache
(total)
Thermal
solution
Chiplets Core
config[ii]
TDP Release
date
MSRP
Base Boost
Ryzen 9 7950X3D 16 (32) 4.2 5.7 128 MB[iii] 2 × CCD
1 × I/OD
2 × 8 120 W Feb 28, 2023 US $699
7950X 4.5 64 MB 170 W Sep 27, 2022
7900X3D 12 (24) 4.4 5.6 128 MB[iii] 2 × 6 120 W Feb 28, 2023 US $599
7900X 4.7 64 MB 170 W Sep 27, 2022 US $549
7900 3.7 5.4 Wraith Prism 65 W Jan 10, 2023 US $429[60]
PRO 7945 Wraith Spire Jun 13, 2023 OEM
Ryzen 7 7800X3D 8 (16) 4.2 5.0 96 MB 1 × CCD
1 × I/OD
1 × 8 120 W Apr 6, 2023 US $449
7700X 4.5 5.4 32 MB 105 W Sep 27, 2022 US $399
7700 3.8 5.3 Wraith Prism 65 W Jan 10, 2023 US $329[60]
PRO 7745 Wraith Spire Jun 13, 2023 OEM
Ryzen 5 7600X3D[61][62] 6 (12) 4.1 4.7 96 MB 1 × 6 Aug 31, 2024[iv] US $299
7600X 4.7 5.3 32 MB 105 W Sep 27, 2022
7600 3.8 5.1 Wraith Stealth 65 W Jan 10, 2023 US $229[60]
PRO 7645 Wraith Spire Jun 13, 2023 OEM
7500F 3.7 5.0 Wraith Stealth Jul 22, 2023 US $179[63]
  1. ^ Self identifies as "AMD Radeon Graphics". See RDNA 2 § Integrated graphics processors (iGPs).
  2. ^ Core Complexes (CCX) × cores per CCX
  3. ^ a b Only one of the two CCXes has additional 64 MB 3D V-Cache.[58] Only the CCX without 3D V-Cache will be able to reach the maximum boost clocks. The CCX with 3D V-Cache will clock lower.[59]
  4. ^ Release date for US, where it is only sold though MicroCenter.[61] In Europe it is only available in Germany, and only through MindFactory, which released it on September 5, 2024.[62]

Storm Peak (Threadripper 7000 series, Zen 4 based)

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Common features of Ryzen 7000 HEDT/workstation CPUs:

  • Socket: sTR5.
  • Threadripper CPUs support DDR5-5200 in quad-channel mode while Threadripper PRO CPUs support DDR5-5200 in octa-channel mode with ECC support.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 1 MB per core.
  • Threadripper CPUs support 48 PCIe 5.0 and 24 PCIe 4.0 lanes while Threadripper PRO CPUs support 128 PCIe 5.0 lanes. In addition, all processor models have 4 PCIe 4.0 lanes reserved as link to the chipset.
  • No integrated graphics.
  • Fabrication process: TSMC 5FF.
Branding and model Cores
(threads)
Clock rate (GHz) L3 cache
(total)
TDP Chiplets Core
config[i]
Release
date
MSRP
Base Boost
Ryzen
Threadripper
PRO
7995WX 96 (192) 2.5 5.1 384 MB 350 W 12 × CCD
1 × I/OD
12 × 8 Nov 21, 2023[64] US $9999
7985WX 64 (128) 3.2 256 MB 8 × CCD
1 × I/OD
8 × 8 US $7349
7975WX 32 (64) 4.0 5.3 128 MB 4 × CCD
1 × I/OD
4 × 8 US $3899
7965WX 24 (48) 4.2 4 × 6 US $2649
7955WX 16 (32) 4.5 64 MB 2 × CCD
1 × I/OD
2 × 8 US $1899
7945WX 12 (24) 4.7 2 × 6 US $1399
Ryzen
Threadripper
7980X 64 (128) 3.2 5.1 256 MB 8 × CCD
1 × I/OD
8 × 8 US $4999
7970X 32 (64) 4.0 5.3 128 MB 4 × CCD
1 × I/OD
4 × 8 US $2499
7960X 24 (48) 4.2 4 × 6 US $1499
  1. ^ Core Complexes (CCXs) × cores per CCX

Ryzen 8000 series

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Phoenix (8000 series, Zen 4 based)

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Common features of Ryzen 8000 desktop CPUs:

  • Socket: AM5.
  • All the CPUs support DDR5-5200 RAM in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 1 MB per core.
  • All the CPUs support 20 PCIe 4.0 lanes. 4 of the lanes are reserved as link to the chipset.
  • No integrated graphics.
  • Fabrication process: TSMC 4 nm FinFET.
Branding
and model
Cores
(threads)
Clock rate (GHz) L3 cache
(total)
NPU Thermal
solution
TDP Core
config[a]
Release
date
MSRP
Base Boost
Ryzen 7 8700F 8 (16) 4.1 5.0 16 MB Partial[b] Wraith
Stealth
65 W 1 × 8 April 1, 2024[65] OEM[66]
Ryzen 5 8400F 6 (12) 4.2 4.7 No 1 × 6
  1. ^ Core Complexes (CCX) × cores per CCX.
  2. ^ Ryzen AI is only available when paired with a Radeon graphics card that features AI acceleration, such as the RX 7000 series.

Phoenix (8000 series with Radeon Graphics, Zen 4/RDNA3/XDNA based)

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Common features of Ryzen 8000G desktop APUs:

  • Socket: AM5.
  • All the CPUs support DDR5-5200 RAM in dual-channel mode in 2x1R and 2x2R configuration, but only DDR5-3600 for 4x1R and 4x2R.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 1 MB per core.
  • Models with Zen 4c cores (codenamed Phoenix 2) support 14 PCIe 4.0 lanes, while models without them support 20 lanes. 4 of the lanes are reserved as link to the chipset.
  • Includes integrated RDNA 3 GPU.
  • Includes XDNA AI Engine (Ryzen AI) on models without Zen 4c cores.
  • Fabrication process: TSMC 4 nm FinFET.
Branding
and model
CPU GPU NPU Thermal
solution
TDP Release
date
MSRP
Cores (threads) Clock rate (GHz) L3 cache
(total)
Core
config[a]
Model Core
config[b][c]
Clock
(GHz)
Total Zen 4 Zen 4c Base Boost
Ryzen 7 8700G[d] 8 (16) 8 (16) 4.2 5.1 16 MB 1 × 8 780M 12 CUs
768:48:24:12
2.9 Ryzen AI
Up to 16 TOPS
Wraith Spire 65 W Jan 31, 2024[67] US $329
Ryzen 5 8600G[d] 6 (12) 6 (12) 4.3 5.0 1 × 6 760M 8 CUs
512:32:16:8
2.8 Wraith Stealth US $229
8500G[d] 2 (4) 4 (8) 4.1 / 3.2[e] 5.0 / 3.7[f] 2 + 4 740M 4 CUs
256:16:8:4
No US $179
Ryzen 3 8300G[d] 4 (8) 1 (2) 3 (6) 4.0 / 3.2[e] 4.9 / 3.6[f] 8 MB 1 + 3 2.6 Jan 2024 (OEM) /
Q1 2024 (retail)
OEM /
TBA
  1. ^ Core Complexes (CCX) × cores per CCX, or Zen 4 + Zen 4c cores
  2. ^ Unified shaders : Texture mapping units : Render output units : Ray accelerators : AI accelerators and Compute units (CU)
  3. ^ GPUs based on RDNA 3 have dual-issue stream processors so that up to two shader instructions can be executed per clock cycle under certain parallelism conditions.
  4. ^ a b c d Model also available as PRO version as 8300G,[68], 8500G,[69], 8600G,[70], 8700G,[71]
  5. ^ a b Zen 4 cores' base frequency / Zen 4c cores' base frequency
  6. ^ a b Zen 4 cores' boost frequency / Zen 4c cores' boost frequency

Ryzen 9000 series

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Granite Ridge (9000 series, Zen 5 based)

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Common features of Ryzen 9000 desktop CPUs:

  • Socket: AM5.
  • All the CPUs support DDR5-5600 in dual-channel mode.
  • All the CPUs support 28 PCIe 5.0 lanes. 4 of the lanes are reserved as link to the chipset.
  • Includes integrated RDNA2 GPU with 2 CUs and base, boost clock speeds of 0.4 GHz, 2.2 GHz.
  • L1 cache: 80 KB (48 KB data + 32 KB instruction) per core.
  • L2 cache: 1 MB per core.
  • Fabrication process: TSMC N4 FinFET (N6 FinFET for the I/O die).
Branding and Model Cores
(threads)
Clock rate (GHz) L3 cache
(total)
TDP Chiplets Core
config[i]
Release
date
Launch
price[a]
Base Boost
Ryzen 9 9950X[72][73] 16 (32) 4.3 5.7 64 MB 170 W 2 × CCD
1 × I/OD
2 × 8 August 15, 2024 US $649
9900X[72][73] 12 (24) 4.4 5.6 120 W 2 × 6 US $499
Ryzen 7 9800X3D[74][75] 8 (16) 4.7 5.2 96 MB 1 × CCD
1 × I/OD
1 × 8 November 7, 2024 US $479
9700X[72][73] 3.8 5.5 32 MB 65 W[b] August 8, 2024 US $359
Ryzen 5 9600X[72][73] 6 (12) 3.9 5.4 1 × 6 US $279
  1. ^ Manufacturer suggested retail price at launch
  2. ^ TDP configurable to 105 W
  1. ^ Core Complexes (CCX) × cores per CCX

Mobile processors

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Ryzen 2000 series

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Raven Ridge (Zen/GCN5 based)

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Common features of Ryzen 2000 notebook APUs:

  • Socket: FP5.
  • The U-series CPUs support DDR4-2400 in dual-channel mode, while the H-series CPUs support it at DDR4-3200 speeds.
  • L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • All the CPUs support 12 PCIe 3.0 lanes.
  • Includes integrated GCN 5th generation GPU.
  • Fabrication process: GlobalFoundries 14LP.
Branding and Model CPU GPU TDP Release
date
Cores
(threads)
Clock rate (GHz) L3 cache
(total)
Core
config[i]
Model[a] Clock
(GHz)
Config[ii] Processing
power
(GFLOPS)[iii]
Base Boost
Ryzen 7 2800H 4 (8) 3.3 3.8 4 MB 1 × 4 RX Vega 11 1.3 704:44:16
11 CUs
1830.4 35–54 W Sep 10, 2018
2700U[b] 2.2 RX Vega 10 640:40:16
10 CUs
1664 12–25 W Oct 26, 2017
Ryzen 5 2600H 3.2 3.6 Vega 8 1.1 512:32:16
8 CUs
1126.4 35–54 W Sep 10, 2018
2500U[b] 2.0 12–25 W Oct 26, 2017
Ryzen 3 2300U[b] 4 (4) 3.4 Vega 6 384:24:8
6 CUs
844.8 Jan 8, 2018
2200U 2 (4) 2.5 1 × 2 Vega 3 192:12:4
3 CUs
422.4
  1. ^ Core Complexes (CCX) × cores per CCX
  2. ^ Unified shaders : Texture mapping units : Render output units and Compute units (CU)
  3. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. ^ Branded as Radeon Vega instead of Radeon RX Vega on the PRO CPUs.
  2. ^ a b c Model also available as PRO version as 2300U, 2500U, 2700U, released on May 15, 2018.

Ryzen 3000 series

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Dalí (Zen/GCN5 based)

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Common features of Ryzen 3000 notebook APUs:

Branding and Model CPU GPU TDP Release
date
Cores
(threads)
Clock rate (GHz) L3 cache
(total)
Core
config[i]
Model Clock
(GHz)
Config[ii] Processing
power
(GFLOPS)[iii]
Base Boost
Ryzen 3 3250U 2 (4) 2.6 3.5 4 MB 1 × 2 Vega 3 1.2 192:12:4
3 CUs
460.8 12–25 W Jan 6, 2020
3250C Sep 22, 2020
3200U Jan 6, 2019
  1. ^ Core Complexes (CCX) × cores per CCX
  2. ^ Unified Shaders : Texture Mapping Units : Render Output Units and Compute Units (CU)
  3. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.


Picasso (Zen+/GCN5 based)

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Common features of Ryzen 3000 notebook APUs:

Branding and Model CPU GPU TDP Release
date
Cores
(threads)
Clock rate (GHz) L3 cache
(total)
Core
config[i]
Model Clock
(GHz)
Config[ii] Processing
power
(GFLOPS)[iii]
Base Boost
Ryzen 7 3780U[76] 4 (8) 2.3 4.0 4 MB 1 × 4 RX Vega 11 1.4 704:44:16
11 CU
1971.2 15 W Oct 2019
3750H[77] RX Vega 10 640:40:16
10 CU[78]
1792.0 35 W Jan 6, 2019
3700C[79] 15 W Sep 22, 2020
3700U[a][80] Jan 6, 2019
Ryzen 5 3580U[81] 2.1 3.7 Vega 9 1.3 576:36:16
9 CU
1497.6 Oct 2019
3550H[82] Vega 8 1.2 512:32:16
8 CU[83]
1228.8 35 W Jan 6, 2019
3500C[84] 15 W Sep 22, 2020
3500U[a][85] Jan 6, 2019
3450U[86] 3.5 Jun 2020
Ryzen 3 3350U[87] 4 (4) Vega 6 384:24:8
6 CU[88]
921.6 Jan 6, 2019
3300U[a][89]
  1. ^ Core Complexes (CCX) × cores per CCX
  2. ^ Unified Shaders : Texture Mapping Units : Render Output Units and Compute Units (CU)
  3. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. ^ a b c Model also available as PRO version[90][91][92], released April 8, 2019.

Ryzen 4000 series

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Renoir (Zen 2/GCN5 based)

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Common features of Ryzen 4000 notebook APUs:

Branding and Model CPU GPU TDP Release
date
Cores
(threads)
Clock rate (GHz) L3 cache
(total)
Core
config[i]
Model Clock
(GHz)
Config[ii] Processing
power
(GFLOPS)[iii]
Base Boost
Ryzen 9 4900H 8 (16) 3.3 4.4 8 MB 2 × 4 Radeon
Graphics
[a]
1.75 512:32:8
8 CU
1792 35–54 W Mar 16, 2020
4900HS 3.0 4.3 35 W
Ryzen 7 4800H[93] 2.9 4.2 1.6 448:28:8
7 CU
1433.6 35–54 W
4800HS 35 W
4980U[b] 2.0 4.4 1.95 512:32:8
8 CU
1996.8 10–25 W Apr 13, 2021
4800U 1.8 4.2 1.75 1792 Mar 16, 2020
4700U[c] 8 (8) 2.0 4.1 1.6 448:28:8
7 CU
1433.6
Ryzen 5 4600H[94] 6 (12) 3.0 4.0 2 × 3 1.5 384:24:8
6 CU
1152 35–54 W
4600HS[95] 35 W
4680U[b] 2.1 448:28:8
7 CU
1344 10–25 W Apr 13, 2021
4600U[c] 384:24:8
6 CU
1152 Mar 16, 2020
4500U 6 (6) 2.3
Ryzen 3 4300U[c] 4 (4) 2.7 3.7 4 MB 1 × 4 1.4 320:20:8
5 CU
896
  1. ^ Core Complexes (CCX) × cores per CCX
  2. ^ Unified shaders : texture mapping units : render output units and compute units (CU)
  3. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. ^ All of the iGPUs are branded as AMD Radeon Graphics.
  2. ^ a b Only found on the Microsoft Surface Laptop 4.
  3. ^ a b c Model also available as PRO version as 4450U,[96] 4650U,[97] 4750U,[98] released May 7, 2020.

Ryzen 5000 series

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Lucienne (Zen 2/GCN5 based)

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Common features of Ryzen 5000 notebook APUs:

Branding and Model CPU GPU TDP Release
date
Cores
(threads)
Clock rate (GHz) L3 cache
(total)
Core
config[i]
Model Clock
(GHz)
Config[ii] Processing
power
(GFLOPS)[iii]
Base Boost
Ryzen 7 5700U 8 (16) 1.8 4.3 8 MB 2 × 4 Radeon
Graphics
[a]
1.9 512:32:8
8 CU
1945.6 10–25 W Jan 12, 2021
Ryzen 5 5500U[99] 6 (12) 2.1 4.0 2 × 3 1.8 448:28:8
7 CU
1612.8
Ryzen 3 5300U 4 (8) 2.6 3.8 4 MB 1 × 4 1.5 384:24:8
6 CU
1152
  1. ^ Core Complexes (CCX) × cores per CCX
  2. ^ Unified shaders : texture mapping units : render output units and compute units (CU)
  3. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. ^ All of the iGPUs are branded as AMD Radeon Graphics.

Cezanne and Barceló (Zen 3/GCN5 based)

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Cezanne (2021 models), Barceló (2022 models). Common features of Ryzen 5000 notebook APUs:

Branding and model CPU GPU TDP Release
date
Cores
(threads)
Clock rate (GHz) L3 cache
(total)
Core
config[i]
Model Clock
(GHz)
Config[ii] Processing
power
(GFLOPS)[iii]
Base Boost (Single Core) Boost (All Core)
Ryzen 9 5980HX 8 (16) 3.3 4.8 4.4 16 MB 1 × 8 Radeon
Graphics[a]
2.1 512:32:8
8 CUs
2150.4 35–54 W Jan 12, 2021
5980HS 3.0 4.0 35 W
5900HX 3.3 4.6 4.2 35–54 W
5900HS 3.0 4.0 35 W
Ryzen 7 5800H[100] 3.2 4.4 2.0 2048 35–54 W
5800HS 2.8 35 W
5825U[b][c] 2.0 4.5 15 W Jan 4, 2022
5800U[b] 1.9 4.4 3.4 10–25 W Jan 12, 2021
Ryzen 5 5600H[110] 6 (12) 3.3 4.2 1 × 6 1.8 448:28:8
7 CUs
1612.8 35–54 W
5600HS 3.0 35 W
5625U[b][c] 2.3 4.3 3.6 15 W Jan 4, 2022
5600U[b] 4.2 10–25 W Jan 12, 2021
5560U 4.0 8 MB 1.6 384:24:8
6 CUs
1228.8
5500H 4 (8) 3.3 4.2 1 × 4 1.8 1382.4 35–54 W Jun 23, 2023
Ryzen 3 5425U[b][c] 2.3 4.3 3.8 1.6 1228.8 15 W Jan 4, 2022
5400U[b][111] 2.7 4.1 10–25 W Jan 12, 2021
5125C 2 (4) 3.0 1 × 2 1.2 192:12:8
3 CUs
460.8 15 W May 5, 2022
  1. ^ Core Complexes (CCX) × cores per CCX
  2. ^ Unified shaders : texture mapping units : render output units and compute units (CU)
  3. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. ^ All of the iGPUs are branded as AMD Radeon Graphics.
  2. ^ a b c d e f Model also available as PRO version as 5450U,[101] 5650U,[102] 5850U,[103] released on March 16, 2021 and as 5475U,[104] 5675U,[105] 5875U,[106] released on April 19, 2022.
  3. ^ a b c Model also available as Chromebook optimized version as 5425C,[107] 5625C,[108] 5825C,[109] released on May 5, 2022.

Ryzen 6000 series

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Rembrandt (Zen 3+/RDNA2 based)

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Common features of Ryzen 6000 notebook APUs:

  • Socket: FP7, FP7r2.
  • All the CPUs support DDR5-4800 or LPDDR5-6400 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • All the CPUs support 16 PCIe 4.0 lanes.
  • Includes integrated RDNA 2 GPU.
  • Fabrication process: TSMC N6 FinFET.
Branding and model CPU GPU TDP Release
date
Cores
(threads)
Clock (GHz) L3 cache
(total)
Core
config[i]
Model Clock
(GHz)
Config[ii] Processing
power
(GFLOPS)[iii]
Base Boost
Ryzen 9 6980HX 8 (16) 3.3 5.0 16 MB 1 × 8 680M 2.4 768:48:8
12 CUs
3686.4 45 W Jan 4, 2022
[112]
6980HS 35 W
6900HX[a] 4.9 45 W
6900HS[a] 35 W
Ryzen 7 6800H[a] 3.2 4.7 2.2 3379.2 45 W
6800HS[a] 35 W
6800U[a] 2.7 15–28 W
Ryzen 5 6600H[a] 6 (12) 3.3 4.5 1 × 6 660M 1.9 384:24:8
6 CUs
1459.2 45 W
6600HS[a] 35 W
6600U[a] 2.9 15–28 W
  1. ^ Core Complexes (CCX) × cores per CCX
  2. ^ Unified shaders : texture mapping units : render output units and compute units (CU)
  3. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. ^ a b c d e f g h Model also available as PRO version (6650U[113], 6650H[114], 6650HS[115], 6850U[116], 6850H[117], 6850HS[118], 6950H[119], 6950HS[120]), released on April 19, 2022.

Ryzen 7000 series

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Mendocino (7020 series, Zen 2/RDNA2 based)

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Common features of Ryzen 7020 notebook APUs:

  • Socket: FT6
  • All the CPUs support LPDDR5-5500 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • All the CPUs support 4 PCIe 3.0 lanes.
  • Includes integrated RDNA 2 GPU.
  • Fabrication process: TSMC N6 FinFET.
Branding and Model CPU GPU TDP Release
date
Cores
(threads)
Clock rate (GHz) L3 cache
(total)
Core
config[i]
Model Clock
(GHz)
Processing
power[ii]
(GFLOPS)
Base Boost
Ryzen 5 7520U[iii] 4 (8) 2.8 4.3 4 MB 1 × 4 610M
2 CU
1.9 486.4 15 W September 20, 2022[121]
Ryzen 3 7320U[iii] 2.4 4.1
  1. ^ Core Complexes (CCX) × cores per CCX
  2. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  3. ^ a b Model also available as Chromebook optimized version as 7520C[122] and 7320C[123] released on May 23, 2023


Barcelo-R (7030 series, Zen 3/GCN5 based)

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Common features of Ryzen 7030 notebook APUs:

Branding and Model CPU GPU TDP Release
date
Cores
(threads)
Clock rate (GHz) L3 cache
(total)
Core
config[a]
Model Clock
(GHz)
Processing
power[b]
(GFLOPS)
Base Boost
Ryzen 7 (PRO) 7730U 8 (16) 2.0 4.5 16 MB 1 × 8 Vega
8 CU
2.0 2048 15 W January 4, 2023
[124]
Ryzen 5 (PRO) 7530U 6 (12) 1 × 6 Vega
7 CU
1792
Ryzen 3 (PRO) 7330U 4 (8) 2.3 4.3 8 MB 1 × 4 Vega
6 CU
1.8 1382.4
  1. ^ Core Complexes (CCX) × cores per CCX
  2. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

Rembrandt-R (7035 series, Zen 3+/RDNA2 based)

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Common features of Ryzen 7035 notebook APUs:

  • Socket: FP7, FP7r2.
  • All the CPUs support DDR5-4800 or LPDDR5-6400 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • All the CPUs support 16 PCIe 4.0 lanes.
  • Includes integrated RDNA 2 GPU.
  • Fabrication process: TSMC N6 FinFET.
Branding and model CPU GPU TDP Release
date[125]
Cores
(threads)
Clock (GHz) L3 cache
(total)
Core
config[a]
Model Clock
(GHz)
Processing
power[b]
(GFLOPS)
Base Boost
Ryzen 7 7735HS 8 (16) 3.2 4.75 16 MB 1 × 8 680M
12 CU
2.2 3379.2 35–54 W April 30, 2023
7735H
7736U 2.7 4.7 15–28 W January 4, 2023
7735U 4.75 15–30 W
7435HS 3.1 4.5 35–54 W 2024[126]
7435H
Ryzen 5 7535HS 6 (12) 3.3 4.55 1 × 6 660M
6 CU
1.9 1459.2 April 30, 2023
7535H
7535U 2.9 15–30 W January 4, 2023
7235HS 4 (8) 3.2 4.2 8 MB 1 × 4 35–53 W 2024[127]
7235H
Ryzen 3 7335U 3.0 4.3 660M
4 CU
1.8 921.6 15–30 W January 4, 2023
  1. ^ Core Complexes (CCX) × cores per CCX
  2. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

Phoenix (7040 series, Zen 4/RDNA3/XDNA based)

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Common features of Ryzen 7040 notebook APUs:

  • Socket: FP7, FP7r2, FP8.
  • All the CPUs support DDR5-5600 or LPDDR5X-7500 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 1 MB per core.
  • PCIe 4.0 support.
  • Native USB 4 (40Gbps) Ports: 2
  • Native USB 3.2 Gen 2 (10Gbps) Ports: 2
  • Includes integrated RDNA 3 GPU.
  • Includes XDNA AI Engine (Ryzen AI).
  • Fabrication process: TSMC N4 FinFET.
Branding and model CPU GPU NPU PCIe
(lanes)
TDP Release
date[128]
Cores
(threads)
Clock (GHz) L3 cache
(total)
Core
config[a]
Model Clock
(GHz)
Total Zen 4 Zen 4c Base Boost
Ryzen 9 (PRO) 7940HS 8 (16) 8 (16) 4.0 5.2 16 MB 1 × 8 780M
12 CU
2.8 Ryzen AI
Up to 10 TOPS
20 35–54 W April 30, 2023[b]
7940H[c]
Ryzen 7 (PRO) 7840HS 3.8 5.1 2.7
7840H[c]
(PRO) 7840U 3.3 15–30 W May 3, 2023[b]
Ryzen 5 (PRO) 7640HS 6 (12) 6 (12) 4.3 5.0 1 × 6 760M
8 CU
2.6 35–54 W April 30, 2023[b]
7640H[c]
(PRO) 7640U 3.5 4.9 15–30 W May 3, 2023[b]
(PRO) 7545U 2 (4) 4 (8) 3.7 / 3.0[d] 4.9 / 3.5[e] 2 + 4 740M
4 CU
2.8 No 14 November 2, 2023
(PRO) 7540U 6 (12) 3.2 4.9 1 × 6 2.5 May 3, 2023[b]
Ryzen 3 7440U 4 (8) 1 (2) 3 (6) 3.6 / 2.8[d] 4.7 / 3.3[e] 8 MB 1 + 3
  1. ^ Core Complexes (CCX) × cores per CCX or Zen 4 + Zen 4c cores
  2. ^ a b c d e PRO versions launched on 13 June 2023.
  3. ^ a b c China-only version of the HS SKU that lacks support for AMD EXPO and FreeSync technologies.
  4. ^ a b Zen 4 cores' base frequency / Zen 4c cores' base frequency
  5. ^ a b Zen 4 cores' boost frequency / Zen 4c cores' boost frequency

Dragon Range (7045 series, Zen 4/RDNA2 based)

edit

Common features of Ryzen 7045 notebook CPUs:

  • Socket: FL1.
  • All the CPUs support DDR5-5200 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 1 MB per core.
  • All the CPUs support 28 PCIe 5.0 lanes.
  • Native USB 4 (40Gbps) Ports: 0
  • Native USB 3.2 Gen 2 (10Gbps) Ports: 4
  • Includes integrated RDNA 2 GPU on the I/O die with 2 CUs and clock speeds of 400 MHz (base), 2.2 GHz (boost)[i].
  • Fabrication process: TSMC N5 FinFET (N6 FinFET for the I/O and graphics die).
Branding and model Cores
(threads)
Clock (GHz) L3 cache
(total)
Chiplets Core
config[a]
TDP Release
date
Base Boost
Ryzen 9 7945HX3D 16 (32) 2.3 5.4 128 MB[ii] 2 × CCD
1 × I/OD
2 × 8 55–75 W July 27, 2023
7945HX 2.5 64 MB February 28, 2023
7940HX 2.4 5.2 January 17, 2024
7845HX 12 (24) 3.0 5.2 2 × 6 45–75 W February 28, 2023
[129]
Ryzen 7 7745HX 8 (16) 3.6 5.1 32 MB 1 × CCD
1 × I/OD
1 × 8
Ryzen 5 7645HX 6 (12) 4.0 5.0 1 × 6
  1. ^ Core Complexes (CCX) × cores per CCX
  1. ^ Self identifies as "AMD Radeon 610M". See RDNA 2 § Integrated graphics processors (iGPs).
  2. ^ Only one of the two CCXes has additional 64 MB of 3D V-Cache. Only the CCX without 3D V-Cache will be able to reach the maximum boost clocks. The CCX with 3D V-Cache will clock lower.

Ryzen 8000 series

edit

Hawk Point (8040 series, Zen 4/RDNA3/XDNA based)

edit

Key features of Ryzen 8040 notebook APUs:

  • Socket: BGA (FP7, FP7r2 or FP8 type packages).
  • All models support DDR5-5600 or LPDDR5X-7500 in 128-bit "dual-channel" mode.
  • CPU uses Zen4 cores (Phoenix) or a combination of Zen4 and Zen4c cores (Phoenix2).
  • GPU uses the RDNA 3 (Navi 3) architecture.
  • Some models include first generation Ryzen AI NPU (XDNA).
  • All models support AVX-512 using a half-width 256-bit FPU.
  • PCIe 4.0 support.
  • Native USB 4 (40Gbps) Ports: 2
  • Native USB 3.2 Gen 2 (10Gbps) Ports: 2
  • Fabrication process: TSMC N4 FinFET.
Branding and model CPU GPU NPU PCIe
(lanes)
TDP Release
date
Cores
(threads)
Clock (GHz) L3 cache
(total)
Core
config[a]
Model Clock
(GHz)
Total Zen 4 Zen 4c Base Boost
Ryzen 9 8945HS 8 (16) 8 (16) 4.0 5.2 16 MB 1 × 8 Radeon 780M
12 CU
2.8 Ryzen AI
up to 16 TOPS
20 35-54 W December 6, 2023[130]
Ryzen 7 8845HS 3.8 5.1 2.7
8840HS 3.3 20-30 W
8840U 15-30 W
Ryzen 5 8645HS 6 (12) 6 (12) 4.3 5.0 1 × 6 Radeon 760M
8 CU
2.6 35-54 W
8640HS 3.5 4.9 20-30 W
8640U 15-30 W
8540U 2 (4) 4 (8) 3.7 / 3.0[b] 4.9 / 3.5[c] 2 + 4 Radeon 740M
4 CU
2.8 No 14
Ryzen 3 8440U 4 (8) 1 (2) 3 (6) 3.6 / 2.8[b] 4.7 / 3.3[c] 8 MB 1 + 3 2.5
  1. ^ Core Complexes (CCX) × cores per CCX or Zen 4 + Zen 4c cores
  2. ^ a b Zen 4 cores' base frequency / Zen 4c cores' base frequency
  3. ^ a b Zen 4 cores' boost frequency / Zen 4c cores' boost frequency

Ryzen AI 300 series

edit

Strix Point (Zen 5/RDNA3.5/XDNA2 based)

edit

Common features of Ryzen AI 300 notebook APUs:

  • Socket: BGA, FP8 package type.
  • All models support DDR5-5600 or LPDDR5X-7500 in dual-channel mode.
  • All models support 16 PCIe 4.0 lanes.
  • Native USB 4 (40Gbps) Ports: 2
  • Native USB 3.2 Gen 2 (10Gbps) Ports: 2
  • iGPU uses the RDNA 3.5 microarchitecture.
  • NPU uses the XDNA 2 AI Engine (Ryzen AI).
  • Both Zen5 and Zen5c cores support AVX-512 using a half-width 256-bit FPU.
  • L1 cache: 80 KB (48 KB data + 32 KB instruction) per core.
  • L2 cache: 1 MB per core.
  • Fabrication process: TSMC N4P FinFET.
Branding and model CPU GPU NPU
(Ryzen AI)
TDP Release
date
Cores (threads) Clock (GHz) L3 cache
(total)
Model Clock
(GHz)
Total Zen 5 Zen 5c Base Boost[a]
Ryzen AI 9 (PRO)
HX 375
12 (24) 4 (8) 8 (16) 2.0 5.1 24 MB 890M
16 CUs
2.9 55 TOPS 15–54 W June 2, 2024 [132]
(PRO)
HX 370[133]
50 TOPS
365[133] 10 (20) 6 (12) 5.0 880M
12 CUs
Ryzen AI 7 PRO 360[134][135] 8 (16) 3 (6) 5 (10) 16 MB October 10, 2024 [136]
  1. ^ This is the maximum frequency for Zen 5 cores. Zen 5c cores boost to 3.3GHz.[131]

Handheld gaming PC processors

edit

Ryzen Z1 series (Zen 4/RDNA3 based)

edit

Common features of Ryzen Z1 handheld APUs:

  • Socket: FP7, FP7r2, FP8.
  • All the CPUs support DDR5-5600 or LPDDR5X-7500 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 1 MB per core.
  • All the CPUs support 20 PCIe 4.0 lanes.
  • Includes integrated RDNA 3 GPU.
  • Fabrication process: TSMC 4 nm FinFET.
Branding and model CPU GPU TDP Release
date
Cores
(threads)
Clock (GHz) L3 cache
(total)
Core
config[a]
Model Clock
(GHz)
Total Zen 4 Zen 4c Base Boost
Ryzen Z1 Extreme 8 (16) 8 (16) 3.3 5.1 16 MB 1 × 8 780M
12 CU
2.7 9–30 W May 2023[137]
Z1 6 (12) 2 (4) 4 (8) 3.2 4.9 2 + 4 740M
4 CU
2.5
  1. ^ Core Complexes (CCX) × cores per CCX or Zen 4 + Zen 4c cores

Embedded processors

edit

1000 series

edit

Great Horned Owl (V1000 series, Zen/GCN5 based)

edit
Model Release
date
Fab CPU GPU Memory
support
TDP Junction
temp.
range

(°C)
Cores
(threads)
Clock rate (GHz) Cache Model Config[i] Clock
(GHz)
Processing
power
(GFLOPS)[ii]
Base Boost L1 L2 L3
V1202B February 2018 GloFo
14LP
2 (4) 2.3 3.2 64 KB inst.
32 KB data
per core
512 KB
per core
4 MB Vega 3 192:12:16
3 CU
1.0 384 DDR4-2400
dual-channel
12–25 W 0–105
V1404I December 2018 4 (8) 2.0 3.6 Vega 8 512:32:16
8 CU
1.1 1126.4 -40–105
V1500B 2.2 0–105
V1605B February 2018 2.0 3.6 Vega 8 512:32:16
8 CU
1.1 1126.4
V1756B 3.25 DDR4-3200
dual-channel
35–54 W
V1780B December 2018 3.35
V1807B February 2018 3.8 Vega 11 704:44:16
11 CU
1.3 1830.4
  1. ^ Unified Shaders : Texture Mapping Units : Render Output Units and Compute Units (CU)
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

Banded Kestrel (R1000 series, Zen/GCN5 based)

edit
Model Release
date
Fab CPU GPU Memory
support
TDP
Cores
(threads)
Clock rate (GHz) Cache Model Config[i] Clock
(GHz)
Processing
power
(GFLOPS)[ii]
Base Boost L1 L2 L3
R1102G February 25, 2020 GloFo
14LP
2 (2) 1.2 2.6 64 KB inst.
32 KB data
per core
512 KB
per core
4 MB Vega 3 192:12:4
3 CU
1.0 384 DDR4-2400
single-channel
6 W
R1305G 2 (4) 1.5 2.8 DDR4-2400
dual-channel
8-10 W
R1505G April 16, 2019 2.4 3.3 12–25 W
R1606G 2.6 3.5 1.2 460.8
  1. ^ Unified Shaders : Texture Mapping Units : Render Output Units and Compute Units (CU)
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

2000 series

edit

Grey Hawk (V2000 series, Zen 2/GCN5 based)

edit
Model Release
date
Fab CPU GPU Socket PCIe
support
Memory
support
TDP
Cores
(threads)
Clock rate (GHz) Cache Archi-
tecture
Config[i] Clock
(GHz)
Processing
power[ii]
(GFLOPS)
Base Boost L1 L2 L3
V2516[138] November 10, 2020[139] TSMC
7FF
6 (12) 2.1 3.95 32 KB inst.
32 KB data
per core
512 KB
per core
8 MB GCN 5 384:24:8
6 CU
1.5 1152 FP6 20
(8+4+4+4)
PCIe 3.0
DDR4-3200
dual-channel

LPDDR4X-4266
quad-channel
10–25 W
V2546[138] 3.0 3.95 35–54 W
V2718[138] 8 (16) 1.7 4.15 448:28:8
7 CU
1.6 1433.6 10–25 W
V2748[138] 2.9 4.25 35–54 W
  1. ^ Unified Shaders : Texture Mapping Units : Render Output Units and Compute Units (CU)
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

River Hawk (R2000 series, Zen+ based)

edit
Model Release
date
Fab CPU GPU Socket PCIe
support
Memory
support
TDP
Cores
(threads)
Clock rate (GHz) Cache Archi-
tecture
Config[i] Clock
(GHz)
Processing
power[ii]
(GFLOPS)
Base Boost L1 L2 L3
R2312[140] June 7, 2022[141] GloFo
12LP
2 (4) 2.7 3.5 64 KB inst.
32 KB data
per core
512 KB
per core
4 MB GCN 5 192:12:4
3 CU
1.2 460.8 FP5 8 lanes
Gen 3
DDR4-2400
dual-channel ECC
10–25 W
R2314[140] 4 (4) 2.1 384:24:8
6 CU
921.6 16 lanes
Gen 3
DDR4-2666
dual-channel ECC
10–35 W
  1. ^ Unified Shaders : Texture Mapping Units : Render Output Units and Compute Units (CU)
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

3000 series

edit

(V3000 series, Zen 3 based)

edit
Model Release
date
Fab CPU Socket PCIe
support
Memory
support
TDP
Cores
(threads)
Clock rate (GHz) Cache
Base Boost L1 L2 L3
V3C14[142][143] September 27, 2022[144] TSMC
7FF
4 (8) 2.3 3.8 32 KB inst.
32 KB data
per core
512 KB
per core
8 MB FP7r2 20
(8+4+4+4)
PCIe 4.0
DDR5-4800
dual-channel
15 W
V3C44[142][143] 3.5 3.8 45 W
V3C16[142][143] 6 (12) 2.0 3.8 16 MB 15 W
V3C18I[142][143] 8 (16) 1.9 3.8 15 W
V3C48[142][143] 3.3 3.8 45 W

7000 series

edit

(Ryzen Embedded 7000 series, Zen 4/RDNA2 based)

edit

Common features of Ryzen Embedded 7000 series CPUs:

  • Socket: AM5.
  • All the CPUs support ECC DDR5-5200 dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 1 MB per core.
  • All the CPUs support 28 PCIe 5.0 lanes. 4 of the lanes are reserved as link to the chipset.
  • Includes integrated RDNA 2 GPU with 2 CUs and boost clock speeds of 2200 MHz.
  • Fabrication process: TSMC N5 FinFET (N6 FinFET for the I/O die).
Processor
branding
Model Cores
(threads)
Clock rate (GHz) L3 cache
(total)
Chiplets Core
config[i]
TDP Release
date
Base Boost
Ryzen
Embedded
7945 12 (24) 3.7 5.4 64 MB 2 × CCD
1 × I/OD
2 × 6 65 W Nov 14, 2023[145]
7745 8 (16) 3.8 5.3 32 MB 1 × CCD
1 × I/OD
1 × 8
7700X 4.5 5.4 105 W
7645 6 (12) 3.8 5.1 1 × 6 65 W
7600X 4.7 5.3 105 W
  1. ^ Core Complexes (CCX) × cores per CCX

See also

edit

References

edit
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AMD Ryzen 9000 CPUs List