Common features of Ryzen AI 300 notebook APUs:
- Socket: BGA, FP8 package type.
- All models support DDR5-5600 or LPDDR5X-7500 in dual-channel mode.
- CPU uses a combination of Zen5 and Zen5c cores.
- GPU uses the RDNA 3.5 GPU architecture.
- NPU uses the XDNA 2 AI Engine (Ryzen AI).
- All models support 16 PCIe 4.0 lanes.
- Fabrication process: TSMC 4 nm FinFET.
| Branding and Model | CPU | GPU | NPU | TDP | Release date | ||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
| Cores (threads) |
Clock (GHz) | L3 cache (total) |
Core config[a] |
Model | Clock (GHz) | ||||||
| Base | Boost | ||||||||||
| Ryzen AI 9 | HX 370[1] | 12 (24) | 2.0 | 5.1 | 24 MB | 4 + 8 | 890M 16 CUs |
2.9 | Ryzen AI Up to 50 TOPS |
15–54 W | July 17, 2024 |
| 365[1] | 10 (20) | 5.0 | 4 + 6 | 880M 12 CUs | |||||||
| Ryzen AI 7 | PRO 360[2] | 8 (16) | 5.1 | 8 MB | 3 + 5 | 870M | TBA | TBA | TBA | TBA | |
| PRO 160[3] | 4.2 | ||||||||||
- ^ Core Complexes (CCX) × cores per CCX or Zen 5 + Zen 5c cores
Template documentation | Common place to discuss layout and style of the AMD APU tables at: Talk:List of AMD processors with 3D graphics. |
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References
- ^ a b Ganti, Anil (3 June 2024). "Computex 2024 | AMD Ryzen AI 9 HX 370 and Ryzen AI 9 365 unveiled with new CPU cores and GPU". NotebookCheck. Retrieved 3 June 2024.
- ^ Yuan, Gu (2024-07-06). "AMD Ryzen AI 9 HX 370/7 PRO 360 APU 跑分曝光". IT Home (in Simplified Chinese). Archived from the original on 2024-07-06. Retrieved 2024-07-08.
- ^ Klotz, Aaron (2024-07-05). "Ryzen AI 7 Pro 160 bests previous-gen Ryzen 9 — chip hits Geekbench with three Zen 5 and five Zen 5c cores". Tom's Hardware. Archived from the original on 2024-07-07. Retrieved 2024-07-08.