Rolf Alfons Aschenbrenner from the Fraunhofer IZM, Berlin, Germany was named Fellow of the Institute of Electrical and Electronics Engineers (IEEE) in 2013[1] for contributions to microelectronic packaging.
References
edit- ^ "2013 elevated fellow" (PDF). IEEE Fellows Directory. Archived from the original (PDF) on 2017-08-29. Retrieved 2017-04-13.
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