Talk:Ball grid array

UNRELIABLE,TOO MANY DISADVANTAGES AND FAILURES. WE NEED ALTERNATIVE.

When is the industry going to recognize this? THIS COST CUTTING BS IS BAD. There are way too many failures and lifespan issues with this stupid technology. I hope there is alternative. Why can't pins be made just like for CPU's? Go back to pins. BGA is awful and a backward anachronism.--65.26.30.35 (talk) 07:55, 19 May 2018 (UTC)

Untitled

I put some sample instructions for re-balling and it has been removed! It is useful and relevant information. Please justify.

I just added an xray photo of the BGA joints - does that help? DJGB 09:29, 11 October 2006 (UTC)

No further comments, so I'm going to remove the cleanup tag DJGB 10:24, 31 October 2006 (UTC)

Do not touch the balls?

Does anybody knows, whether it is possible to test a BGA housing (contacting the balls) and afterwards to solder it normally to a PCB. Or is the BGA destroyed by testing, which would be a disadvantage as it would not be possible to do a final product verification of a BGA packaged device. Michilans (talk) 16:30, 2 December 2008 (UTC)

 I can think of no reason why not. ICs are tested all the time.

Sharper X-ray

There is a much sharper X-ray image at http://upload.wikimedia.org/wikipedia/commons/6/61/X-Ray_USB-Stick_Intenso_High-Speed_32GB_broken.jpg It is still unclear (to me at least) how the bond wires reach the balls. 69.239.104.44 (talk) 13:50, 18 June 2010 (UTC)

History?

If someone knows and have a bit to tell about the development of the BGA package. Please add it & references. Electron9 (talk) 20:40, 22 March 2008 (UTC)

uBGA/μBGA/micro BGA/TinyBGA(TM)

What about these? For example, what's the exact difference between BGA & uBGA ? Like, if pitch is bigger than 0.5mm it's BGA, but if it's 0.5mm or smaller it's uBGA, or what?

If you remove the solder, from a BGA chip, are there bumps, or just pads ? Like a PCB has it's pads flat against the board substrate. --DaveDodgy (talk) 14:05, 23 April 2008 (UTC)

Yeah, I'm not quite understanding how this works at all....or really what advantage it has over pins. Seems like it'd be easier to make it all flow into one globby square than to make pins that are very close to each other short out...maybe I'm just looking at it from the wrong viewpoint. —Preceding unsigned comment added by 146.145.251.34 (talk) 21:08, 13 October 2010 (UTC)

Finest pitch

What's the finest pitch a (μ)BGA chip has been made ? As in, the width of the pad & the spacing between pads (centres, not edge to edge).--DaveDodgy (talk) 18:25, 10 May 2008 (UTC)

Sometimes?

Article: "BGAs do not have this problem, because the solder is sometimes factory-applied to the package in exactly the right amount." So, do they sometimes not have the problem because sometimes this is done and sometimes for other reasons? Or do they sometimes have the problem because the factory didn't apply the solder? --128.197.11.28 (talk) 14:51, 4 August 2008 (UTC)

External links

• Some external links is useless for article. Need cleanup...--Berserkerus (talk) 16:05, 15 November 2008 (UTC)

Most of the external links were useless. All except for one have been removed. Rilak (talk) 05:58, 16 November 2008 (UTC)

BGA lineage

The first sentence of the Discussion section is "The BGA is descended from the pin grid array (PGA)". I disagree. Soldering and inserting pins into sockets are two different ways of making electrical connections, but one is not a descendant of another anymore than a car is a descendant of a horse (two different means of transportation).

Additionally, the grammar is incorrect: "is descended" should be changed either to "is a descendant" or to just "descended". —Preceding unsigned comment added by 74.96.187.144 (talk) 18:51, 14 November 2009 (UTC)

I agree that directly soldering a chip to a board is a very different process from inserting a pin into a socket. However, it appears that the process of manufacturing such packages is practically the same. I've seen several datasheets[1] where "the same" microprocessor is available in two different packages -- a PGA and a BGA, i.e., one with pins and one with balls. It's exactly the same internal chip, and as far as I can tell the internal bond wires, external plastic packaging, etc. are identically the same. The only difference is at the very end of the manufacturing process where (as far as I can tell -- original research?) the practically identical nearly-finished microprocessors (looking something like a land grid array) are randomly divided up, with some getting pins attached while others have balls attached.

So yes -- the BGA is a descendant of the PGA, similar to the way that the horseless carriage is a descendant of the horse-drawn carriage, or the buggy (automobile) is a descendent of the horse and buggy.

I agree that the process of using and maintaining horses, and the vehicles drawn by them, is very different from using maintaining auto-mobile vehicles. However, often a manufacturer that makes one also makes the other, and the process of manufacturing such carriages is mostly identical (a particular same wheel, axle, leaf spring, chair, etc could go into either kind of vehicle). --DavidCary (talk) 16:28, 20 April 2013 (UTC)

Ball Numbering System

The Balls are numbered in the following way ... (Sorry I don't have any idea ...) — Preceding unsigned comment added by 2A02:1205:5019:C900:1D3F:3BA4:61B6:30CC (talk) 02:03, 6 December 2016 (UTC)

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